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Hisashi Kanazashi

Director, IT Div

Ministry of Economy, Trade and Industry (METI)

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Kazunari Ishimaru

Senior Managing Executive Officer, Silicon Technology Division, IEEE Fellow

Rapidus

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Dr. Yasumitsu Orii

Senior Managing Executive Officer, 3D Assembly Division

Rapidus

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Dr. Hamid Azimi

Corporate Vice President, Intel Director, Substrate Packaging Technology Development

Intel

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Lode Lauwers

Senior Vice President Business Development & Sales

imec

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Shinichi Yoshioka

Senior Vice President and Chief Technology Officer

Renesas

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Deepak Kulkarni

Senior Fellow Advanced Packaging

AMD

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Kathy Yan

Director, NTSI (New Technology & System Integration Division)

TSMC

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Axel Bialke

SVP Asia

aiMotive

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Katsumi Furuse

Sr. Manager Wirebond/Power BU Power

Amkor Technology, Inc.

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Choon Khoon Lim

Senior Vice President; Co-CEO, Semiconductor Solutions Segment

ASMPT

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Dr. Koukou Suu

President, Entegris Japan

Entegris

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Dr. Nahomi Aoto

Professor by Special Designation

Hiroshima University

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Joe Wu

CEO

JSMC Holdings, Inc.

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Oreste Donzella

Executive VP – EPC (Electronics, Packaging, and Component) Group

KLA

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Kamel Ait-Mahiout

President

ISES

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Ken Shibata

President, ISES Japan

ISES

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Shigeru Shiratake

Corporate Vice President DRAM Process Integration and Device Technology

Micron Technology, Inc.

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Akira Minamikawa

Senior Analyst

OMDIA

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Toshihito Tsuga

Regional Account Business Unit

Onto Innovation

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Hidenori Abe

Executive Director

Resonac Corporation

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Dr. Seungwook Yoon

CVP Business Development Team, AVP

Samsung

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Christophe Maleville

CTO Senior, EVP Innovation

Soitec

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Dr. Tetsuo Endoh

Professor

Tohoku University Center for Innovative Integrated Electronic Systems

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Dr. Kazuaki Sawada

Professor

Toyohashi University of Technology

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Joseph Roybal

Senior Vice President of Global Backend Operations

Wolfspeed

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