アジェンダ – ISES日本 2024

ISES日本 2024

5-6 March 2024, Tokyo Hilton

ISES Japan logo
Day 1 – March 5 Day 2 – March 6

Day 2 – March 6

  • 08:15 – 08:45 
  • Registration

Front End Technology

  • 08:45 – 9:10 
  • Keynote: The Challenge of Speed – The Rapidus Model for a New Manufacturing Era
  • 09:15 – 09:40 
  • Keynote: Renesas’ Technology Strategy for a Paradigm Shift in the Semiconductor Industry
  • 09:45 – 10:45 
  • Networking Session/ Business Meeting 5&6
  • 10:45 – 11:10 
  • DRAM challenges and innovations for demanding AI workloads
  • 11:15 – 11:40 
  • Semiconductor Innovation Success: Building on Global Collaboration Amongst Trusted Partners in Nanoelectronics R&D
  • 11:45 – 12:45 
  • Lunch

Power Semiconductor Session

  • 12:45 – 13:05 
  • Semiconductor Innovations Across a More Diversified End Market 
  • 13:10 – 13:30  
  • An OSAT Perspective of the Power Semiconductor Market
  • 13:35 – 13:55 
  • Packaging Trends in the Power Semiconductor Market
  • 14:10
  • Summit Closing Address
  • 14:15 – 15:15 
  • Networking Session/ Business Meeting 7&8
  • 15:15 – 15:30
  • Prepare for Departure
  • 15:30
  • Resonac Site Tour Visit
  • 15:30: Departure for Resonac Site Tour Visit 
  • 16:30: Arrival at Packing Solution Center 
  • 16:40 – 17:10: PSC Explanation
  • 17:10 – 18:10 Site Tour  
  • 18:10 – 19:20: Networking Dinner  
  • 19:20 – Departure from Resonac 
  • 20:30 – Arrival at Hilton Tokyo 

Note: Times are approximate and subject to change based on tour duration and travel conditions. 

アジェンダ Day 1