Agenda – ISES Japan 2024

ISES Japan 2024

5-6 March 2024, Tokyo Hilton

ISES Japan logo

Day 1 – March 5

  • 07:00 – 08:00
  • Registration
  • 08:00 – 08:25
  • Welcome Speech
Salah Nasri photo
Salah Nasri

President
ISES

  • 08:30 – 08:55
  • Japan’s Policy Trends in Semiconductor and Digital Industry Strategy
  • 09:00 – 09:25
  • Keynote: Glass Core Substrate: Next Gen Advanced Packaging Technology
  • 09:30 – 09:55
  • Keynote: Challenges and Opportunities of Semiconductor Packaging in the Chiplet Era
  • 10:00 – 10:25
  • Keynote: 3DFabric Advanced Packaging Technology Innovations for AI/HPC
  • 10:30 – 11:30
  • Networking Break / Business Meeting 1&2 
  • 11:30 – 11:55
  • Keynote: Enabling AI revolution through innovations in Advanced Packaging and Chiplet Technology 
  • 12:00 – 12:20
  • Key Challenges in Enabling AI and Specialty Segments via Metrology, Inspection and Lithography Technologies
  • 12:25 – 12:35
  • Enabling the AI Era
  • 12:40 – 13:00
  • The development of 3D stacking wafer-on-wafer(WoW) technology can provide a large number of connections between the SoC and memory chip, enable solutions for the memory bandwidth and power consumption issues
  • 13:00 – 14:00
  • Lunch
  • 14:00 – 14:25
  • Reserved
  • 14:30 – 14:55
  • New Level Innovation of Advanced Heterogeneous Integration in AI Era
  • 15:00 – 15:25
  • PANEL SESSION: Bridging the Gap Between R&D and Industry to Enhance Workforce Development

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  • 15:30 – 16:30
  • Networking Session / Business Meeting 3 & 4

Market Research

  • 16:30 – 17:00
  • TBC
  • 17:00 – 17:30
  • PANEL SESSION: Innovations and Challenges in Advanced Semiconductor Materials: Perspectives from Entegris, Soitec, and Resonac

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  • 17:30 – 19:00
  • Cocktail Reception
  • 19:00 – 21:00
  • Gala Dinner HOSTED BY SOITEC